Age-Hardening Behavior and the Related Changes in a Silver-Copper-Palladium Alloy

Journal of Advanced Materials and Processing

دوره 8، شماره 2، شهریور 2020، صفحه 33-42   

نوع مقاله: Research Paper

نویسندگان

Morteza Hadi^{* 1}؛ Iman Ebrahimzadeh²؛ Omid Bayat³

¹Metallurgy and Materials Engineering Department, Golpayegan University of Technology, Golpayegan, Iran

²Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran

³Department of Materials science and Engineering, Hamedan University of Technology, Hamedan, Iran

چکیده

Age-hardening behavior and related changes were studied to elucidate the hardening mechanism of an Ag–Cu–Pd alloy by Differential Scanning Calorimetry (DSC), hardness test, X-ray diffraction (XRD), scanning electron microscopic (SEM) observations and energy dispersive spectrometer (EDS). The results showed that hardness of the alloy was raised to 90% and 68% of its solution state value by isothermal aging at 300 ^◦C and 400 ^◦C, respectively. However, aging at 500 ^◦C led to a decrease in the hardness of the alloy. Moreover, while age hardening at 300 ^◦C occurred due to coherency strains between the (111) plane of Ag-rich and the (111) plane of Cu₃Pd phases, the mechanism of aging at 400 ^◦C was the formation of Cu₃Pd superlattice with the L1₂-type crystal structure. In contrast, reduction of Cu₃Pd phase and formation of Cu solid solution decreased hardness during aging at 500^oC.

کلیدواژه‌ها

Ag-Cu-Pd alloys؛ Age-hardening؛ Scanning electron microscopy؛ X-ray diffraction

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