A Novel High Sensitivity MEMS Acoustic Sensor using Corrugated Diaphragm

Majlesi Journal of Electrical Engineering

مقاله 7، دوره 11، شماره 4، اسفند 2017، صفحه 53-57   

نوع مقاله: Review Article

نویسندگان

Bahram Azizollah Ganji^{* 1}؛ Mehdi Taybi²

¹Department of Electrical and Computer Engineering, Babol University of Technology, Babol

²Department of Electrical and Computer Engineering, Babol University of Technology, Babol, Iran

چکیده

In this paper we presented a novel MEMS acoustic sensor using corrugated diaphragm. The corrugated diaphragm is used to decrease the effect of residual stress and thus improve the sensitivity of micromachined acoustic sensor. The displacement and mechanical sensitivity of flat and corrugated diaphragms, and also open-circuit sensitivity and pull-in voltage of sensors are calculated using MATLAB and simulated using FEM (finite element method). The results show that the displacement and mechanical sensitivity of corrugated diaphragm are bigger than the flat one. The pull-in voltage of corrugated sensor is smaller and the open-circuit sensitivity is much higher than the sensor with flat diaphragm. The results also show that the analytical model is very close with FEM simulation results.  

مراجع

1. S. A. Patil, J. H. L. Hansen “the physiological microphone (PMIC): A competitive alternative for speaker assessment in stress detection and speaker verification”, Speech Communication, pp 327-340, 2010
2. Y. W. Bai, C. H. Yeh, “Design and Implementation of a Remote Embedded DSP Stethoscope with a Method for Judging Heart Murmur” International Instrumentation and Measurement Technology Conference, Singapore, May 2009.
3. W. H. Ko, L. Fellow, R. Zhang, P. Uang, J. Guo, X. Ye, D. J. Young, and C. A. Egerian “Studies of MEMS Acoustic Sensors as Implantable Microphones for Totally Implantable Hearing-Aid Systems” IEEE Transactions on Biomedical Circuits and Systems, Vol. 3, pp. 275-288, October 2009.
4. C. K. Chan, W. C. Lai , M. Wu, M. Y. Wang, and W. Fang, “Design and Implementation of a Capacitive-Type Microphone with Rigid Diaphragm and Flexible Spring Using the Two Poly Silicon Micromachining Processes” IEEE Sensors Journal, Vol. 11, No. 10, pp 2365-2371 October 2011.
5. M. Goto, Y. Iguchi, K. Ono, A. Ando, F. Takeshi, S. Matsunaga, Y. Yasuno, K. Tanioka, and T. Tajima “High-Performance Condenser Microphone with Single-Crystalline Silicon Diaphragm and Backplate” IEEE Sensors Journal, Vol. 7, pp. 4-10, January 2007.
6. B. A. Ganji, B. Y. Majlis, “Design and fabrication of a new MEMS capacitive microphone using a perforated aluminium diaphragm” Sensors and Actuators, pp. 29–37, 2009.
7. W. J. Wang, R. M. Lin and Y. Ren , “Design and fabrication of high sensitive microphone diaphragm using deep corrugation technique” Springer, Microsystem Technologies, pp. 142–146, 2004.
8. J. Miao, R. Lin, L. Chen, Q. Zou, S.Y. Lim, S.H. Seah, “Design considerations in micromachined silicon microphones”, Microelectronics Journal, pp. 21–28, January 2002.
9. Chen Jing, Liu Litian, et al, "Design, simulation and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique," Proceding of SPIE Optoelectronics and microelectronics (OM 2001), Nanjing, China, pp. 79-83, (2001).
10. Chen Jing, Liu Litian et al, "Dynamic characteristics of novel single-chip fabricated corrugated diaphragms for micro-acoustic devices," IEEE, pp. 757-760, (2001).
11. M. T. Abuelma’atti, “Large signal performance of micromachined silicon condenser microphones” Applied Acoustics, pp. 616–627, 2007.
12. P.R. Scheeper, A.G.H. Donk, W. Olthuis and P. Bergveld, “A review of silicon microphones”, Elsevier, Sensors and Actuators, Vol. A 44, pp. 1-11, 1994.
13. Mehdi Taybi and Bahram Azizollah Ganji, “The Effect of Corrugations on Mechanical Sensitivity of Diaphragm for MEMS Capacitive Microphone” IJE TRANSACTIONS B: Applications Vol. 26, No. 11, PP. 1371-1378, 2013.
14. P.R Scheeper, W.Olthuis and P. Bergveld, “The Design, Fabrication, and Testing of Corrugated Silicon Nitride Diaphragms”, Journal of Microelectromechanical Systems, Vol. 3, NO. 1, pp.36-42, 1994.